Quickly and easily Socket your 35x35mm, 0.8mm pitch BGA1764 packages on any PCB without significant performance loss
榮夏科技為Ironwood Electronic 台灣區授權代理商
Ironwood Electronics has recently introduced a new high performance BGA socket for 0.8mm pitch, 1764 pin BGA IC’s. The SG-BGA-6503 socket is designed for IC size – 35x35mm package size and operates at bandwidths up to 27 GHz with less than 1dB of insertion loss.
The contact resistance is typically 20 milliohms per pin. The socket connects all pins with 27 GHz bandwidth on all connections. The socket is mounted on the target PCB with no soldering, and uses industry’s smallest footprint. The socket is constructed with swivel lid for easy chip replacement. The socket comes with ball guide for the precise alignment of BGA balls to PCB pads. To use, place device inside the socket, place floating compression plate on top of the device, close lid via swivel motion and apply compression by torqueing 50 watt heat sink screw plus fan with mounted bracket.
The SG-BGA-6503 socket is constructed with high performance and low inductance elastomer contactor. The temperature range is -35 C to +125 C. The pin self inductance is 0.15 nH and mutual inductance of 0.025 nH. Capacitance to ground is 0.01 pF. Current capacity is 2 amps per pin. Works with devices such as 1764BGA, 35x35mm package with 42x42 array and 0.8mm pitch.
文章引用自 Ironwood electronics